TY - JOUR
T1 - 3D printable CNTs and BN hybridized PEEK composites for thermal management applications
AU - Bozkurt, Yunus Emre
AU - Emanetoğlu, Uğur
AU - Yıldız, Alptekin
AU - Türkarslan, Özlem
AU - Şaşal, Feride N.
AU - Cebeci, Hulya
N1 - Publisher Copyright:
© 2023, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.
PY - 2023/10
Y1 - 2023/10
N2 - Thermally conductive and three-dimensional (3D) printable polyether ether ketone (PEEK) composite filaments can be feedstock for fabricating thermal management systems through additive manufacturing. The study aims to improve the thermal conductivity of PEEK through hybridization for the 3D printing process. Three different fillers, namely (i) micron-sized hexagonal boron nitride (m-BN), (ii) carbon nanotubes (CNTs), and (iii) nano-sized hexagonal boron nitride (n-BN) were selected to fabricate hybrid CNTs/m-BN/PEEK and n-BN/m-BN/PEEK composites at various weight ratios via melt mixing process. The highest thermal conductivities were reported for 1.62 W/mK with 1 wt.% CNTs/ 30 wt.% m-BN, and 1.77 W/mK with 40 wt.% n-BN/m-BN (mass ratio, 3:1). TGA and DSC analyses showed that incorporation of hybrid fillers into the PEEK matrix slightly improved decomposition temperatures; however, hybrid fillers did not lead to a significant change in Tg. All CNTs/h-BN hybridized PEEK composites were manufactured in filament form and successfully 3D printed. The CNTs/h-BN PEEK composites would also be good candidates as lightweight advanced packaging materials for injection molding.
AB - Thermally conductive and three-dimensional (3D) printable polyether ether ketone (PEEK) composite filaments can be feedstock for fabricating thermal management systems through additive manufacturing. The study aims to improve the thermal conductivity of PEEK through hybridization for the 3D printing process. Three different fillers, namely (i) micron-sized hexagonal boron nitride (m-BN), (ii) carbon nanotubes (CNTs), and (iii) nano-sized hexagonal boron nitride (n-BN) were selected to fabricate hybrid CNTs/m-BN/PEEK and n-BN/m-BN/PEEK composites at various weight ratios via melt mixing process. The highest thermal conductivities were reported for 1.62 W/mK with 1 wt.% CNTs/ 30 wt.% m-BN, and 1.77 W/mK with 40 wt.% n-BN/m-BN (mass ratio, 3:1). TGA and DSC analyses showed that incorporation of hybrid fillers into the PEEK matrix slightly improved decomposition temperatures; however, hybrid fillers did not lead to a significant change in Tg. All CNTs/h-BN hybridized PEEK composites were manufactured in filament form and successfully 3D printed. The CNTs/h-BN PEEK composites would also be good candidates as lightweight advanced packaging materials for injection molding.
UR - http://www.scopus.com/inward/record.url?scp=85173110859&partnerID=8YFLogxK
U2 - 10.1007/s10853-023-08923-4
DO - 10.1007/s10853-023-08923-4
M3 - Article
AN - SCOPUS:85173110859
SN - 0022-2461
VL - 58
SP - 15086
EP - 15099
JO - Journal of Materials Science
JF - Journal of Materials Science
IS - 38
ER -