• İTÜ Ayazağa Kampüsü

    34000 Istanbul

    Turkey

Calculated based on number of publications stored in Pure and citations from Scopus
20092023

Research activity per year

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  • 2023

    Data Center Energy Optimization Under Different Dynamic Pricing Schemes

    Nkwawir, B. W., Erden, H. S. & Duman, A. C., 2023, 2023 International Conference on Smart Energy Systems and Technologies, SEST 2023. Institute of Electrical and Electronics Engineers Inc., (2023 International Conference on Smart Energy Systems and Technologies, SEST 2023).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • Investigations on the cost-effective design and operation of water-based thermal energy storage systems for data centers

    Abdolhosseinzadeh, A. & Erden, H. S., 2023, 2023 ASHRAE Annual Conference. American Society of Heating Refrigerating and Air-Conditioning Engineers, p. 202-210 9 p. (ASHRAE Transactions; vol. 129).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2022

    IN THE SEARCH FOR THE FUTURE ENGINEER: THE EELISA DISCIPLINARY BROADENING WORKSHOP EXPERIENCE

    Görgül, E. & Erden, H. S., 2022, SEFI 2022 - 50th Annual Conference of the European Society for Engineering Education, Proceedings. Jarvinen, H.-M., Silvestre, S., Llorens, A. & Nagy, B. V. (eds.). European Society for Engineering Education (SEFI), p. 1206-1216 11 p. (SEFI 2022 - 50th Annual Conference of the European Society for Engineering Education, Proceedings).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    Open Access
  • 2019

    Thermal profiling of a small operational data center

    Türkmen, İ., Mercan, C. A. & Erden, H. S., 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019. American Society of Mechanical Engineers (ASME), (ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2018

    Investigation of CRAH bypass for air-cooled data centers using computational fluid dynamics

    Ebrahimpour, V. & Erden, H. S., 2 Jul 2018, 2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8612311. (INTELEC, International Telecommunications Energy Conference (Proceedings); vol. 2018-October).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    5 Citations (Scopus)
  • 2017

    Investigation of induced CRAH bypass for air-cooled data centers using computational fluid dynamics

    Erden, H. S., 20 Nov 2017, 2017 25th International Conference on Software, Telecommunications and Computer Networks, SoftCOM 2017. Begusic, D., Saric, M., Radic, J. & Rozic, N. (eds.). Institute of Electrical and Electronics Engineers Inc., 8115552. (2017 25th International Conference on Software, Telecommunications and Computer Networks, SoftCOM 2017).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    3 Citations (Scopus)
  • Worldwide energy analysis of major free cooling methods for data centers

    Gozcu, O., Ozada, B., Carfi, M. U. & Erden, H. S., 25 Jul 2017, Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017. Institute of Electrical and Electronics Engineers Inc., p. 968-976 9 p. 7992592. (Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    18 Citations (Scopus)
  • 2016

    Energy assessment of CRAH bypass for enclosed aisle data centers

    Erden, H. S., Yildirim, M. T., Koz, M. & Khalifa, H. E., 20 Jul 2016, Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc., p. 433-439 7 p. 7517581. (Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    9 Citations (Scopus)
  • Experimental investigation of CRAH bypass for enclosed aisle data centers

    Erden, H. S., Yildirim, M. T., Koz, M. & Khalifa, H. E., 20 Jul 2016, Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc., p. 1293-1299 7 p. 7517697. (Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    10 Citations (Scopus)
  • Numerical investigation of the melting of a phase change material in a thermal storage device with embedded air flow channels

    Koz, M., Erden, H. S. & Khalifa, H. E., 2016, Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing. American Society of Mechanical Engineers, (ASME 2016 Heat Transfer Summer Conference, HT 2016, collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels; vol. 2).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    3 Citations (Scopus)
  • 2015

    Parameter estimation for lumped capacitance modeling of crah units during chilled water interruption

    Erden, H. S. & Khalifa, H. E., 2015, Thermal Management. American Society of Mechanical Engineers, (ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels; vol. 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    5 Citations (Scopus)
  • Proposal for standard compact server model for transient data center simulations

    Pardey, Z. M., Demetriou, D. W., Erden, H. S., VanGilder, J. W., Khalifa, H. E. & Schmidt, R. R., 2015, ASHRAE Transactions. American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE), p. 413-421 9 p. (ASHRAE Transactions; vol. 121).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    32 Citations (Scopus)
  • 2014

    Development of an IT equipment lumped capacitance parameter database for transient data center simulations

    Demetriou, D. W., Erden, H. S., Khalifa, H. E. & Schmidt, R. R., 4 Sept 2014, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Institute of Electrical and Electronics Engineers Inc., p. 1330-1337 8 p. 6892434. (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    6 Citations (Scopus)
  • Energy saving potential of low-temperature cooling of computers

    Khalifa Ezzat, H., Erden, H. S. & De Rouge, R. B., 4 Sept 2014, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Institute of Electrical and Electronics Engineers Inc., p. 1121-1128 8 p. 6892406. (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2013

    Assessment of the energy performance of cogeneration systems for powering and cooling data centers

    Ringham, D. C., Rice, D. J., Granetz, B. S., Erden, H. S., Ezzat Khalifa, H. & Schmidt, R. R., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; vol. 2).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • Room-level transient CFD modeling of rack shutdown

    Erden, H. S., Ezzat Khalifa, H. & Schmidt, R. R., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; vol. 2).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    10 Citations (Scopus)
  • Transient thermal response of servers through air temperature measurements

    Erden, H. S., Ezzat Khalifa, H. & Schmidt, R. R., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; vol. 2).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    14 Citations (Scopus)
  • 2011

    Design of simulated server racks for data center research

    Smith, J. F., Abdelmaksoud, W. A., Erden, H. S., Dannenhoffer, J. F., Dang, T. Q., Khalifa, H. E., Schmidt, R. R. & Iyengar, M., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 415-422 8 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; vol. 2).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    14 Citations (Scopus)